► "One Core, Infinite Carrier Boards":
The modular design is engineered to slash development cycles and R&D costs for new product categories:
● Full GPIO Breakout: All essential I/Os are routed to the SO-DIMM interface, allowing clients to develop simple 1-4 layer carrier boards for specific projects.
● Elastic Material Compatibility: Pre-engineered to support 10+ WiFi modules, DDR3/LPDDR3 DRAM, and EMMC/NAND Flash variants, ensuring a resilient supply chain against component shortages.
● Streamlined Production: Avoids the "Double-Reflow" trap, significantly lowering the barrier for entry for smaller factories and reducing the scrap rate during mass production.